Brunschwiler, T.: search on Z-Library

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1

[IEEE Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - San Diego, CA (May 30-June 2, 2006)] Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture

Brunschwiler, T., Rothuizen, H., Fabbri, M., Kloter, U., Michel, B., Bezama, R.J., Natarajan, G.

Year:

2006

Language:

english

File:

PDF, 1.63 MB

english, 2006

2

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Brunschwiler, Thomas, Schlottig, Gerd, Ni, Songbo, Liu, Yu, Goicochea, Javier V., Zürcher, Jonas, Wolf, Heiko

Journal:

Journal of Electronic Packaging

Year:

2014

Language:

english

File:

PDF, 7.25 MB

english, 2014

3

Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design

R. Wälchli, T. Brunschwiler, B. Michel, D. Poulikakos

Journal:

International Journal of Heat and Mass Transfer

Year:

2010

Language:

english

File:

PDF, 673 KB

english, 2010

4

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Brunschwiler, Thomas, Schlottig, Gerd, Ni, Songbo, Liu, Yu, Goicochea, Javier V., Zürcher, Jonas, Wolf, Heiko

Year:

2013

Language:

english

File:

PDF, 3.37 MB

english, 2013

5

Enhanced Percolating Thermal Underfills Achieved by Means of Nanoparticle Bridging Necks

Zurcher, Jonas, Chen, Xi, Burg, Brian R., Zimmermann, Severin, Straessle, Rahel, Studart, Andre R., Brunschwiler, Thomas

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 5.97 MB

english, 2016

6

Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal

Brunschwiler, Thomas, Sridhar, Arvind, Lee Ong, Chin, Schlottig, Gerd

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 2.85 MB

english, 2016

7

Polarization-independent thermooptic phase shifters in silicon-oxynitride waveguides

B.J. Offrein, D. Jubin, T. Koster, T. Brunschwiler, F. Horst, D. Wiesmann, I. Meijer, M.S. Petit, D. Webb, R. Germann, G.L. Bona

Journal:

IEEE Photonics Technology Letters

Year:

2004

Language:

english

File:

PDF, 126 KB

english, 2004

8

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Schlottig, Gerd, de Fazio, Marco, Escher, Werner, Granatieri, Paola, Khanna, Vijayeshwar D., Brunschwiler, Thomas

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 1.88 MB

english, 2016

9

Electrical and Thermal Characterization of an Inductor-Based ANPC-Type Buck Converter in 14 nm CMOS Technology for Microprocessor Applications

Bezerra, Pedro A. M., Krismer, Florian, Kolar, Johann W., Aljameh, Riduan K., Paredes, S., Heller, R., Brunschwiler, T., Francese, Pier A., Morf, T., Kossel, Marcel A., Braendli, M.

Journal:

IEEE Open Journal of Power Electronics

Year:

2020

File:

PDF, 6.25 MB

2020

10

Interlayer cooling potential in vertically integrated packages

T. Brunschwiler, B. Michel, H. Rothuizen, U. Kloter, B. Wunderle, H. Oppermann, H. Reichl

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 1.54 MB

english, 2009

11

Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks

Renfer, Adrian, Tiwari, Manish K., Tiwari, Rashmita, Alfieri, Fabio, Brunschwiler, Thomas, Michel, Bruno, Poulikakos, Dimos

Journal:

International Journal of Heat and Mass Transfer

Year:

2013

Language:

english

File:

PDF, 2.76 MB

english, 2013

12

[IEEE 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO) - Rome, Italy (2015.7.27-2015.7.30)] 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO) - Enhanced thermal underfills by bridging nanoparticle assemblies in percolating microparticle beds

Zurcher, Jonas, Xi Chen,, Burg, Brian R., Zimmermann, Severin, Brunschwiler, Thomas, Guo Hong,, Studart, Andre R., Potasiewicz, Grzegorz, Warszynski, Piotr

Year:

2015

Language:

english

File:

PDF, 1.78 MB

english, 2015

13

Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]

Brunschwiler, Thomas, Zürcher, Jonas, Del Carro, Luca, Schlottig, Gerd, Burg, Brian, Zimmermann, Severin, Zschenderlein, Uwe, Wunderle, Bernhard, Schindler-Saefkow, Florian, Stässle, Rahel

Journal:

Journal of Electronic Packaging

Year:

2017

File:

PDF, 23 KB

2017

14

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels

Brunschwiler, Thomas, Steller, Wolfram, Oppermann, Hermann, Kleff, Jessica, Robertson, Stephen, Mrosko, Raul, Keller, Jurgen, Schlottig, Gerd

Year:

2018

Language:

english

File:

PDF, 10.08 MB

english, 2018

15

Toward five-dimensional scaling: How density improves efficiency in future computers

Ruch, P., Brunschwiler, T., Escher, W., Paredes, S., Michel, B.

Journal:

IBM Journal of Research and Development

Year:

2011

Language:

english

File:

PDF, 2.77 MB

english, 2011

16

Hierarchically Nested Channels for Fast Squeezing Interfaces With Reduced Thermal Resistance

Brunschwiler, Thomas, Kloter, Urs, Linderman, Ryan J., Rothuizen, Hugo, Michel, Bruno

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 1.52 MB

english, 2007

17

On the significance of developing boundary layers in integrated water cooled 3D chip stacks

Fabio Alfieri, Manish K. Tiwari, Igor Zinovik, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos

Journal:

International Journal of Heat and Mass Transfer

Year:

2012

Language:

english

File:

PDF, 896 KB

english, 2012

18

[IEEE Management Symposium (SEMI-THERM) - San Jose, CA, USA (2011.03.20-2011.03.24)] 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks

Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B.

Year:

2011

Language:

english

File:

PDF, 1.77 MB

english, 2011

19

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

Brunschwiler, Thomas, Zürcher, Jonas, Del Carro, Luca, Schlottig, Gerd, Burg, Brian, Zimmermann, Severin, Zschenderlein, Uwe, Wunderle, Bernhard, Schindler-Saefkow, Florian, Stässle, Rahel

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 4.82 MB

english, 2016

20

[IEEE 2018 IEEE 20th International Conference on e-Health Networking, Applications and Services (Healthcom) - Ostrava (2018.9.17-2018.9.20)] 2018 IEEE 20th International Conference on e-Health Networking, Applications and Services (Healthcom) - COPD Management by Symptom and Activity Tracking

Brunschwiler, T., Hu, Rui, Van Kessel, T., Lopez, A., Barroso, J.

Year:

2018

Language:

english

File:

PDF, 589 KB

english, 2018

21

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 1: Thermal Management - Benchmarking Study on the Thermal Management Landscape for 3D ICs: From Back-Side to Volumetric Heat Removal

Brunschwiler, Thomas, Sridhar, Arvind, Ong, Chin Lee, Schlottig, Gerd

Year:

2015

Language:

english

File:

PDF, 3.47 MB

english, 2015

22

[IEEE 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) - Dresden (2010.03.8-2010.03.12)] 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) - Energy-efficient variable-flow liquid cooling in 3D stacked architectures

Coskun, Ayse K, Atienza, David, Rosing, Tajana Simunic, Brunschwiler, Thomas, Michel, Bruno

Year:

2010

Language:

english

File:

PDF, 519 KB

english, 2010

23

Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill

Straessle, Rahel, Zimmermann, Severin, del Carro, Luca, Zurcher, Jonas, Schlottig, Gerd, Achen, Albert, Hong, Guo, Poulikakos, Dimos, Brunschwiler, Thomas

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 2.25 MB

english, 2018

24

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels

Brunschwiler, Thomas, Mrossko, Raul, Keller, Jurgen, Ozsun, Ozgur, Schlottig, Gerd

Year:

2016

Language:

english

File:

PDF, 1.15 MB

english, 2016

25

[IEEE 2017 IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL) - Stanford, CA, USA (2017.7.9-2017.7.12)] 2017 IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL) - Analysis and comparative evaluation of stacked-transistor half-bridge topologies implemented with 14 nm bulk CMOS technology

Bezerra, P. A. M., Aljameh, R. K., Krismer, F., Kolar, J. W., Sridhar, A., Brunschwiler, T., Toifl, T.

Year:

2017

Language:

english

File:

PDF, 1.68 MB

english, 2017

26

[IEEE Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, USA (2007.03.18-2007.03.22)] Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces

Linderman, R. J., Brunschwiler, T., Kloter, U., Toy, H., Michel, B.

Year:

2007

Language:

english

File:

PDF, 641 KB

english, 2007

27

A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study

Sharma, Chander Shekhar, Schlottig, Gerd, Brunschwiler, Thomas, Tiwari, Manish K., Michel, Bruno, Poulikakos, Dimos

Journal:

International Journal of Heat and Mass Transfer

Year:

2015

Language:

english

File:

PDF, 3.15 MB

english, 2015

28

[IEEE 2019 IEEE International Conference on Healthcare Informatics (ICHI) - Xi'an, China (2019.6.10-2019.6.13)] 2019 IEEE International Conference on Healthcare Informatics (ICHI) - Towards Automatic Cough and Snore Detection

Vhaduri, Sudip, Brunschwiler, Thomas

Year:

2019

Language:

english

File:

PDF, 3.49 MB

english, 2019

29

Wie lange und in welchen Mengen werden Antibiotika bei der intramammären Behandlung der Kuh mit der Milch ausgeschieden?

Kästli, P., Brunschwiler, F.

Journal:

Year:

1961

Language:

german

File:

PDF, 980 KB

german, 1961

30

Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics

Adrian Renfer, Manish K. Tiwari, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos

Journal:

Experiments in Fluids

Year:

2011

Language:

english

File:

PDF, 835 KB

english, 2011

31

Self-Contained, Oscillating Flow Liquid Cooling System for Thin Form Factor High Performance Electronics

Wälchli, R., Brunschwiler, T., Michel, B., Poulikakos, D.

Journal:

Journal of Heat Transfer

Year:

2010

Language:

english

File:

PDF, 749 KB

english, 2010

32

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Advances in percolated thermal underfill (PTU) simulations for 3D-integration

Kumar, S. G., Zschenderlein, U., Pantou, R., Brunschwiler, T., Schlottig, G., Schindler-Saefkow, F., Wunderle, B.

Year:

2015

Language:

english

File:

PDF, 1.58 MB

english, 2015

33

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K

Brunschwiler, Thomas, Zurcher, Jonas, Zimmermann, Severin, Burg, Brian R., Schlottig, Gerd, Xi Chen,, Sinha, Tuhin, Baum, Mario, Hofmann, Christian, Pantou, Remi, Achen, Albert, Zschenderlein, Uwe, K

Year:

2016

Language:

english

File:

PDF, 2.29 MB

english, 2016

34

Steady-state low thermal resistance characterization apparatus: The bulk thermal tester

Burg, Brian R., Kolly, Manuel, Blasakis, Nicolas, Gschwend, Dominic, Zürcher, Jonas, Brunschwiler, Thomas

Journal:

Review of Scientific Instruments

Year:

2015

Language:

english

File:

PDF, 1.95 MB

english, 2015

35

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - 2D Magnetic Inductors for DC-DC Converters on Glass Interposer

Lafage, Vincent, Beilliard, Yann, Sridhar, Arvind, Brunschwiler, Thomas, Drouin, Dominique

Year:

2018

File:

PDF, 387 KB

2018

36

[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Microfluidic Interposer for High Performance Fluidic Chip Cooling

Steller, Wolfram, Windrich, Frank, Bremner, Douglas, Robertson, Stephen, Mrosko, Raul, Keller, Jurgen, Brunschwiler, Thomas, Schlottig, Gerd, Oppermann, Hermann, Wolf, M. Jurgen, Lang, Klaus-Dieter

Year:

2018

Language:

english

File:

PDF, 931 KB

english, 2018

37

IoT-Based Home Monitoring: Supporting Practitioners’ Assessment by Behavioral Analysis

Mora, Niccolò, Grossi, Ferdinando, Russo, Dario, Barsocchi, Paolo, Hu, Rui, Brunschwiler, Thomas, Michel, Bruno, Cocchi, Francesca, Montanari, Enrico, Nunziata, Stefano, Matrella, Guido, Ciampolini, P

Journal:

Year:

2019

File:

PDF, 1.60 MB

2019

38

Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices

Del Carro, Luca, Zinn, Alfred A., Ruch, Patrick, Bouville, Florian, Studart, André R., Brunschwiler, Thomas

Journal:

Journal of Electronic Materials

Year:

2019

File:

PDF, 6.70 MB

2019

39

[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Anisotropic Composite Core Material for Inductor-based Fully Integrated Voltage Regulator

Ye, Suiying, Sridhar, Arvind, Carro, Luca Del, McCloskey, Paul, Masood, Ansar, Brunschwiler, Thomas

Year:

2019

File:

PDF, 3.30 MB

2019

40

[ASME 2010 14th International Heat Transfer Conference - Washington, DC, USA (August 8–13, 2010)] 2010 14th International Heat Transfer Conference, Volume 8 - Direct Waste Heat Utilization From Liquid-Cooled Supercomputers

Brunschwiler, Thomas, Meijer, Gerhard Ingmar, Paredes, Stephan, Escher, Werner, Michel, Bruno

Year:

2010

Language:

english

File:

PDF, 479 KB

english, 2010

41

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Forced convective interlayer cooling in vertically integrated packages

Brunschwiler, Thomas, Michel, B., Rothuizen, Hugo, Kloter, U., Wunderle, B., Oppermann, H., Reichl, H.

Year:

2008

Language:

english

File:

PDF, 1.71 MB

english, 2008

42

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Sequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation

Schlottig, Gerd, Schindler-Saefkow, Florian, Zurcher, Jonas, Michel, Bruno, Brunschwiler, Thomas

Year:

2013

Language:

english

File:

PDF, 432 KB

english, 2013

43

In Situ Assembly in Confined Spaces of Coated Particle Scaffolds as Thermal Underfills with Extraordinary Thermal Conductivity

Hong, Guo, Schutzius, Thomas M., Zimmermann, Severin, Burg, Brian R., Zürcher, Jonas, Brunschwiler, Thomas, Tagliabue, Giulia, Michel, Bruno, Poulikakos, Dimos

Journal:

ACS Applied Materials & Interfaces

Year:

2015

Language:

english

File:

PDF, 8.79 MB

english, 2015

44

Bevacizumab-induced tumor calcifications can be elicited in glioblastoma microspheroid culture and represent massive calcium accumulation death (MCAD) of tumor endothelial cells

Weiseenthal, Larry, Williamson, Summer, Brunschwiler, Cindy, Rueff-Weisenthal, Constance

Journal:

Bioentrepreneur

Year:

2012

File:

PDF, 11.90 MB

2012

45

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Heat-removal performance scaling of interlayer cooled chip stacks

Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B., Cesar, W., Leblebici, Y., Wunderle, B., Reichl, H.

Year:

2010

Language:

english

File:

PDF, 1.58 MB

english, 2010

46

(Invited) Wafer-Level Integration of Embedded Cooling Approaches

Paredes, S., Madhour, Y., Schlottig, G., Ong, C. L., Brunschwiler, T.

Journal:

ECS Transactions

Year:

2014

Language:

english

File:

PDF, 595 KB

english, 2014

47

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Study of two-phase pressure drop and heat transfer in a micro-scale pin fin cavity: Part B

Parida, Pritish R., Sridhar, Arvind, Brunschwiler, Thomas, Chainer, Timothy

Year:

2016

Language:

english

File:

PDF, 1.50 MB

english, 2016

48

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Morphology of Low-Temperature All-Copper Interconnects Formed by Dip Transfer

Carro, Luca Del, Zuercher, Jonas, Gerke, Sebastian, Wildsmith, Thomas, Ramos, Gustavo, Brunschwiler, Thomas

Year:

2017

Language:

english

File:

PDF, 934 KB

english, 2017

49

Comparison of transient and static test methods for chip-to-sink thermal interface characterization

B. Smith, T. Brunschwiler, B. Michel

Journal:

Microelectronics Journal

Year:

2009

Language:

english

File:

PDF, 710 KB

english, 2009

50

[IEEE 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Budapest, Hungary (2007.09.17-2007.09.19)] 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - High-performance thermal interface technology overview

Linderman, R., Brunschwiler, T., Smith, B., Michel, B.

Year:

2007

Language:

english

File:

PDF, 861 KB

english, 2007

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